At MemoryC we have multiple warehouses. This product is available to be transferred to the warehouse nearest your location, and is estimated to ship within 9 days from your order.
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Like two hot lovers, a heatsink and the processor want to make full contact. But microscopic imperfections in their craftsmanship create small gap for air. These gaps act as thermal insulators, inhibiting the transfer of thermal energy from your components. PK-3 thermal compound is made up of specially designed nano particles, engineered to correct these imperfections. The nano particles work by filling in the small air gaps and allowing for peak transfer of heat away from your components.
Specifications
WEIGHT / VOLUME
1.5 g
THERMAL CONDUCTIVITY
11.2 W/m·K
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