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Intel 670p M.2 2 TB PCI Express 3.0 3D4 QLC NVMe by Intel


Intel 670p M.2 2 TB PCI Express 3.0 3D4 QLC NVMe Image

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Key Features

  • 2 TB M.2 PCI Express 3.0
  • 3D4 QLC NVMe
  • Hardware encryption 256-bit AES
  • Component for: PC/Laptop
See full specifications
See product description

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Details
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Enhanced Power Loss Data Protection prepares the SSD for unexpected system power loss by minimizing data in transition in temporary buffers, and uses on-board power-loss protection capacitance to provide enough energy for the SSD firmware to move data from the transfer buffer and other temporary buffers to the NAND, thus protecting system and user data.

Intel® Rapid Start Technology
Intel® Rapid Start Technology allows quick system resumes from the hibernate state.

Hardware Encryption
Hardware encryption is data encryption done at the drive level. This is used to ensure that the data stored on the drive is secured from unwanted intrusion.

End-to-End Data Protection
End-to-End Data Protection ensures integrity of stored data from the computer to the SSD and back.

Temperature Monitoring and Logging
Temperature Monitoring and Logging uses an internal temperature sensor to monitor and log airflow and device internal temperature. The logged results can be accessed using the SMART command.

Intel® Smart Response Technology
Intel® Smart Response Technology combines the fast performance of a small solid state drive with the large capacity of a hard disk drive.

High Endurance Technology (HET)
High Endurance Technology (HET) in SSD's combines Intel® NAND Flash Memory silicon enhancements and SSD system management techniques to help extend the endurance of the SSD. Endurance is defined as the amount of data that can be written to an SSD during its lifetime.

Intel® Remote Secure Erase
Intel® Remote Secure Erase provides IT administrators a secure method for remotely wiping an Intel SSD from a familiar management console when retiring or repurposing a system. This allows for immediate re-use while saving administrative time and costs.
Specifications
CAPACITY 2 TB
INTERFACE TYPE PCI Express 3.0
FORM FACTOR M.2
FLASH STORAGE DETAILS 3D4 QLC
OPERATING TEMPERATURE 0 - 70 °C
MTBF 1600000 h
SPECIAL FEATURES 256-bit AES
DIMENSIONS 80 mm
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